Odisha Launches India's First Advanced 3D Glass Chip Unit
Odisha's Chief Minister Mohan Majhi laid the foundation for India's first advanced glass substrate chip packaging unit in Bhubaneswar. The facility, developed by US-based 3D Glass Solutions Inc. (3DGS), involves an investment of approximately ₹1,943 crore. It aims to produce 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually, generating over 2,500 jobs. This initiative is part of India's strategy to enhance local semiconductor technology and reduce reliance on imports. The 3DGS plant follows another semiconductor facility by SiCSem Private Limited, which is also under construction at the same site. Both projects were approved by the union cabinet in 2025 as part of a broader effort to establish a self-reliant semiconductor ecosystem in India.
Published 1 day ago • 20 Apr 2026, 07:34 AM IST